1. 2. 3. material content data sheet sales product name ipp70n10s3-12 issued 29. august 2013 ma# MA000408220 package pg-to220-3-1 weight* 2036.98 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.755 0.28 0.28 2825 2825 leadframe non noble metal iron 7439-89-6 0.816 0.04 401 inorganic material phosphorus 7723-14-0 0.245 0.01 120 non noble metal copper 7440-50-8 815.335 40.03 40.08 400266 400788 wire non noble metal aluminium 7429-90-5 5.303 0.26 0.26 2604 2604 encapsulation organic material carbon black 1333-86-4 8.894 0.44 4366 plastics epoxy resin - 97.832 4.80 48028 inorganic material silicondioxide 60676-86-0 486.196 23.87 29.11 238685 291079 leadfinish non noble metal tin 7440-31-5 21.462 1.05 1.05 10536 10536 plating non noble metal nickel 7440-02-0 0.244 0.01 120 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 1 120 solder noble metal silver 7440-22-4 0.117 0.01 57 non noble metal tin 7440-31-5 0.093 0.00 46 non noble metal lead 7439-92-1 4.452 0.22 0.23 2186 2289 heatspreader inorganic material phosphorus 7723-14-0 0.177 0.01 87 non noble metal iron 7439-89-6 0.590 0.03 290 non noble metal copper 7440-50-8 589.466 28.94 28.98 289382 289759 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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